BigPatents India

This publication discloses a method, in which the semiconductor components forming part of an electronic circuit, or at least some of them, are embedded in a base, such as a circuit board, during the manufacture of the base. Thus, the base structure is more or less manufactured around the semiconductor component. According to the invention, first of all at least one conductive pattern and through holes for the semiconductor components are made in the base, After this, the semiconductor components are placed in the holes in alignment with the conductive pattern. The semiconductor components are attached to the structure of the base and one or more conductive pattern layers are made in the base in such a way that at least one conductive pattern forms an electrical contact with the contact areas of the surface of the semiconductor component (FIG. 2C)