: “AN IMPROVED PROCESS FOR THE DEPOSITION OF A CONDUCTING POLYMER FILM ON AN INSULATING SUBSTRATES HAVING INTERDIGITED ELECTRODES”
Application 104/DEL/2001 published 2006-05-12, filed 2001-01-31
This invention relates to an improved process for the deposition of a conducting polymer film on an insulating substrate having interdigited electrodes. In the process, deposition of a conducting polymer film takes place on insulating substrate having planar metallic electrodes placed on them with large inter-electrode spacing. In a feature of the present invention, the conducting polymer films deposited on the preconditioned substrates as described in the invention, in the preferred range of composition exhibited good coverage of the interdigited electrodes and conductivity value of 9 orders of magnitude higher than the film deposited without pretreatment of the substrates.
Applicant
COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH.
RAFI MARG, NEW DELHI – 110 001, INDIA.
Inventor
1. SUBRAMANIAM RADHAKRISHNAN 2. SHRIPAD DAGADOPANT DESHPANDE
International Info
Classification: C08J 7/18; C23C 14/48; C25B 13/00