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A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonxysilane or isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X-R1-Si(OR2)n(R3)3-n#191 (wherein X is NCS- or SCN-, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2 or 3). The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals. (FIG). nil