BigPatents India

A low-cost, fan assisted cooling device 10 is disclosed and includes a heat mass 11, a thermal core 40, a vapor chamber 41, and a phase change liquid 41L sealed in the vapor chamber 41 at a low pressure. Waste heat Hw in the thermal core 40 boils the phase change liquid 41L and converts it into a vapor 41V that rises to contact surfaces (14a14b) of the vapor chamber 40 where it is cooled down and converted back into the phase change liquid 41L. A plurality of vanes 21 and fins 23 are connected with the heat mass 11 and an air flow F over the vanes 21 and fins 23 dissipates heat Hw from the heat mass 11. Consequently, the heat mass 11 is convention cooled by the air flow F and evaporatively cooled by the boiling of the phase change liquid 41L. (FIG.4f).