LASER MICROMACHINING AND METHODS OF SAME
Application 698/KOL/2004 published 2006-10-20, filed 2004-11-08
The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature (404) into a substrate (300), at least in part, by directing a laser beam (410) at the substrate (300). During at least a portion of said forming, the method includes supplying liquid (422) to at least a first region (508a) of the feature along a first liquid supply path (b1) and supplying liquid (422) to at least a second different region (508b) of the feature (404) along at least a second liquid supply path (b2). (FIG:1)
Applicant
HEWLETT PACKARD DEVELOPMENT COMPANY, L.P.
20555 S.H. 249, HOUSTON, TEXAS 77070, UNITED STATES OF AMERICA
Inventor
1. MEHRGAN KHAVARI; 2. CHARLES E. OTIS; 3. MARK HUTH; 4. JEFFREY R. POLLARD
International Info
Classification: B23K 26/14, 26/38; C23F 1/00
Publication Number:
Priority Information
10/713298 USA 2003-11-14