BigPatents India

The present invention discloses a power semiconductor module 10 having encapsulated submodules 1 which, for example, is suitable for power switches, rectifiers for the like in industrial or traction drives. The submodules 1 have a sandwiched structure made up of a ceramic substrate, one or a few power semiconductor chips and a molybdenum wafer, and are potted in plastic. They are held in plug-in locations 19 on a common baseplate 11 and make contact via a stack arrangement of conductors 12, 14, 18. Retention and contact of the submodules 1 take place reversibly via pressure contacts 15, 16, 20, clamp contacts 21 or the like. Important advantages of the power semiconductor module 10 relate to the simple and easily scaleable structure, improved ability to withstand thermal load cycles, and the robustness and easy interchangeability of the submodules.