MICROPUMP AND ADHESIVE-FREE METHOD FOR JOINING TWO SUBSTRATES

Application 1725/KOLNP/2005 published 2006-09-15, filed 2005-08-30
The invention relates to a method for joining a first substrate layer (1), a second substrate layer (2), and a functional element (3). According to said method, the functional element is selected from a material having a pre-determined elasticity; the first and second layers are selected from a material having a pre-determined rigidity; the functional element is sandwiched between the first and second substrate layers; the first and second substrate layers are joined by pressure; and the functional element is clamped in such a way that the first and second substrate layers are permanently interconnected, and the functional element is permanently arranged between the first and second substrate layers. The invention also relates to a device provided with channel-type structures for transporting and/or storing a liquid and/or gaseous medium. Said device comprises a first (1) substrate layer and a second substrate layer (2), and a functional element (3) that is sandwiched between the first and second substrate layers, the channel-type structures being embodied in the first and/or second substrate layer. The first and second substrate layers are solidly and permanently interconnected, and the functional element is clamped between the first and second substrate layers. Said functional element is elastic, the first and second layers are rigid, and the channel-type structures in the first and/or second substrate layers are at least partially sealed in a gas-tight and/or liquid-tight manner due to the functional element. (FIG. 1)

Applicant

BARTELS MIKROTECHNIK GMBH,
EMIL-FIGGE-STRASSE 76, 44227 DORTMUND, GERMANY.

Inventor

MEYKNECHT, RON

International Info

Classification: F04B 43/04, 53/10
Publication Number: WO 05/061894
Application Date: 2004-12-20

Priority Information

10360709.9 GERMANY 2003-12-19