COMPOUND COMPONENT COMPRISING A SEPARATING PLATE, FOR PRODUCING PRINTED CIRCUIT BOARD COMPONETNS, AND METHOD OF PRODUCING SUCH A COMPOUND COMPONENT

Application 1299/DELNP/2004 published 2006-12-08, filed 2004-05-14
A separating plate compound component (1) for producing printed circuit boards by compressing multiplayer (2) stacked with at least one such compound component (1), which compound component (1) includes a separating plate (3) between copper foils (5), anti-adhesive layers (6) being arranged on the separating plate (3) between the latter and the copper foils (5).

Applicant

1)C2C TECHNOLOGIE FÜR LEITERPLATTEN GMBH
:FABRIKSGASSE 13, A-8700 LEOBEN-HINTERBERG, AUSTRIA

Inventor

1)KLAUS TOMASCHITZ 2)ERNST-DIETER BACKHAUS

International Info

Classification: B32B 15/08
Publication Number: WO 03/041956 A1
Application Date: 2002-10-10

Priority Information

A 1797/2001 Australia 2001-11-14