"A PROCESS FOR THE FABRICATION OF IMPROVED METALLISED CERAMIC SUBSTRATE USEFUL FOR ASSEMBLY OF SEMICONDUCTOR DEVICES"
Application 160/DEL/2000 published 2006-12-08, filed 2000-02-25
The present invention relates to the fabrication of metalised ceramic substrate on semiconductor devices which provides a process with increase thickness achieved by electrodeposition of metals with unique combination of Ag-Cu-Ni.
Applicant
1)COUNCIL OF SCIENTIFIC & INDUSTRIAL RESEARCH
:RAFI MARG, NEW DELHI-110 001, INDIA.
Inventor
1)YOGENDRA KUMAR JAIN 2)HARISH CHANDRA PANDEY 3)SATISH KUMAR BHATNAGAR
International Info
Classification: H01L 39/00