BigPatents India

A sputtering cathode (1) for coating processes in a vacuum chamber (18) comprises one at least single-piece target plate (2) mounted on a metallic diaphragm (3). On the side of the diaphragm (3) facing away from the target plate (2) is disposed a cooling agent channel with an inflow line (9) and an outflow line (10) for a cooling agent and a hollow space (7) for at least one magnet system (5). The magnet system (5) is disposed in a supporting tub (6) sealed against the diaphragm (3) and not exposed to the cooling agent. The entire configuration is disposed on a supporting structure (12). In order to improve the heat transfer from the target plate (2) to the cooling agent in simple, efficient and cost-effective manner and to avoid the hazard of the cooling agent penetrating into the vacuum chamber, the invention provides that a) the supporting structure (12) for the sputtering cathode (1) comprises a hollow body (13). which is closed gas-tight against the interior space of the vacuum chamber (18) and which connects the hollow space (7) encompassing the magnet system (5) with the atmosphere outside of the vacuum chamber (18), b) the cooling agent channel is implemented as a conduit (4) closed on its cross sectional periphery with at least one flat side (4a) in thermally conducting connection with the diaphragm (3). and that c) the diaphragm (3) and the surfaces of the conduit (4) facing away from the diaphragm (3) are exposed via said supporting structure (12) to the atmospheric pressure outside of the vacuum chamber (18). (FIG. 1)