PROCESSING FOR BEARING IN BREAKING-THROUGH IN A SUBSTRATE
Application 626/KOL/2005 published 2006-12-22, filed 2005-07-18
The invention relates to a process for bringing in breaking -through (BT) (1) at a pre-determined position in a substrate (2), which is made as printing template, by means of a laser. The substrate (2) is positioned here with the help of a fixing medium (3), which is made as a tenter frame. A local displacement of the BTs (1) on account of the subsequent machining steps, which lead to a changed state of tension of the substrate (2), is avoided by firstly determining the co ordinates of a central reference point (4). The respective distance (a) of the pre determined position of the BTs (1) from this reference point (4) is fixed afterwards and an order of precedence (5) is derived out of this. This order of precedence (5) then forms the basis of a machining program (6), through which the movement track of the laser head is controlled and the BTs (1) are brought in the substrate (2). (FIG. - 1
Applicant
LPKF LASER & ELECTRONICS AG
OSTERIEDE 7, 30827 GARBSEN GERMANY
Inventor
1. WENKE STEPHAN
International Info
Classification: H05K 3/40
Publication Number:
Priority Information
102004036662.4-34 DE 2004-07-28