BigPatents India

The invention relates to a power semiconductor module comprising at least one semiconductor chip (11) made of a semiconductor material, a first and a second main electrode (12, 13), a first and a second main connection (91, 92), and a contact plate (2) that is in electrical contact with the first main electrode (12) and the first main connection (92). Said contact plate (2) contains an alloy partner which can form an eutectic together with the semiconductor material. The inventive contact plate is coated with an electrically conducting protective layer (31, 32), by means of which the first main electrode (12) and the contact plate (2) are prevented from forming a permanent material connection.