BigPatents India

The present invention relates to a polyethylene moulding compound having a multi modal molecular weight distribution which has an overall density of 0.940 g/cm3 and an MFI190/5 in the range from 0.01 to 10 dg/min, characterized in that it comprises an amount of from 30 to 60% by weight of low-molecular-weight ethylene homopolymer A which has a viscosity number VNA in the range from 40 to 150 cm3/g, an amount of from 30 to 65% by weight of high-molecular-weight copolymer B comprising ethylene and a further olefin having from 4 to 10 carbon atoms which has a viscosity number VNB in the range from 150 to 800 cm3/g, and an amount of from 1 to 30% by weight of ultrahigh-molecular-weight ethylene copolymer C which has a viscosity number VNc in the range from 900 to 3000 cm3/g.