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A power semiconductor module is specified, in which at least one semiconductor chip (4) with which contact is made by pressure is electrically connected via a contact element (8) to a main connection (30). The contact element (8) has two planar contact surfaces (81, 82), between which a spring element (7) is located. Irrespective of the individual position and height of a chip (4), the respective spring element (7) ensures a standard contact force. Overloading of the semiconductor chips (4) when the module is being clamped in is prevented by means of ceramic supporting elements (10).