PHOTOSENSITIVE RESIN COMPOSITION FOR LASER ENGRAVABLE PRINTING SUBSTRATE
Application 2039/KOLNP/2006 published 2007-05-18, filed 2006-07-20
A photosensitive resin composition for printing substrate capable of laser sculpture, comprising resin (a) having a polymerizable unsaturated group whose number average molecular weight is in the range of 1000 to 20x104,, organic compound (b) having a polymerizable unsaturated group whose number average molecular weight is
Applicant
1)ASAHI KASEI CHEMICALS CORPORATION
:1-2,YURAKU-CHO 1-CHOME, CHIYODA-KU, TOKYO Japan
Inventor
1)HIROSHI YAMADA 2)KEI TOMEBA No of Pages: 122 No of Claims: 20
International Info
Classification: B41N 1/12
Publication Number: WO 2005/070691
Application Date: 2005-01-26
Priority Information
2004-018470 Japan 2004-01-27