METHOD FOR MANUFACTURING MAGNETRON COATED SUBSTRATES AND MAGNETRON SPUTTER SOURCE

Application 1070/KOLNP/2007 published 2007-07-13, filed 2007-03-27
According to the invention, the sputter rate distribution along the sputter surface (3s) for a magnetron source may be adjusted during the sputter operation, whereby the separation of a piece (7a1, 7b1) of the magnet arrangement (7a, 7b), on the target reverse side (3R) may be correspondingly altered.

Applicant

1) OC OERLIKON BALZERS AG.
FL-9496 BALZERS, LIECHTENSTEIN.

Inventor

1)WEICHART, JURGEN

International Info

Classification: H01J 37/34
Publication Number: WO 2006/034598
Application Date: 2005-07-26

Priority Information

1578/04 Switzerland 2004-09-28