METHOD OF MAKING LIGHT EMITTING DEVICE WITH SILICON-CONTAINING ENCAPSULANT
Application 2119/CHENP/2007 published 2007-09-07, filed 2007-05-17
A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.
Applicant
1)3M INNOVATIVE PROPERTIES COMPANY
:3M CENTER P O BOX 33427 SAINT PAUL MN 55133-3427 U.S.A.
Inventor
1)BOARDMAN, LARRY, D 2)THOMPSON, D, SCOTT 3)LEATHERDALE, CATHERINE, A 4)OUDERKIRK, ANDREW, J
International Info
Classification: H01L 33/00
Publication Number: WO 2006/055456 A1
Application Date: 2005-11-14
Priority Information
10/993,460 U.S.A. 2004-11-18