POWERPACK LASER DIODE ASSEMBLIES

Application 1564/KOLNP/2003 published 2006-04-07, filed 2003-12-02
In one aspect, the invention provides a laser diode assembly, comprising a carrier, a laser diode, a first bonding member, and a second bonding member. The carrier has a conductive layer formed thereon that is sized for attaching at least two bonding members thereto. The laser diode is operably coupled to the carrier and has first and second conductive pads formed thereon. The first and second conductive pads are each sized for attaching at least one bonding member thereto. The first bonding member couples the first conductive pad to the conductive layer of the carrier, and the second bonding member couples the second conductive pad to the conductive layer of the carrier. (FIG. 1)

Applicant

AXCEL PHOTONICS, INC.
45 BARTLETT STREET, MARLBOROUGH, MA 01752, U.S.A

Inventor

(1) GAO WEI

International Info

Classification: H01S 5/022; 5/02
Publication Number: WO02/099940A2-12.12.2002
Application Date: 2001-06-08

Priority Information

09/874,501 U.S.A 2001-06-05