BigPatents India

The present invention provides a dielectric film structure having a substrate and a dielectric film provided on the substrate and in which the 5 dielectric film has (001) face orientation with respect to the substrate, and in which a value u in the following equation (1) regarding the dielectric film is a real number greater than 2: u = (Cc /Ca) x (Wa/Wc) ...(1) where, Cc is a count number of a peak of a (001') face of the dielectric film in an Out-of-plane X ray diffraction measurement (here, l' is a natural number selected so that Cc becomes maximum); Ca is a count number of a peak of a (h'OO) face of the dielectric 15 film in an In-plane X ray diffraction measurement (here, h' is a natural number selected so that Cc becomes maximum); Wc is a half-value width of a peak of the (001') face of the dielectric film in an Out-of-plane rocking curve X ray diffraction measurement; 20 and Wa is a half-value width of a peak of the (h'OO) face of the dielectric film in an In-plane rocking curve X ray diffraction measurement.